问题
浏览：99235 回答：1
Junction-Board - thermal resistance between the junction and the board
Junction-Case Top - thermal resistance between the junction and the case top
Junction-Sides - thermal resistance between the junction and the sides of the case各位大侠,小弟还没有入门,请问上面上面三个解释分别对应那些参数;数据手册上面没有啊(通常情况下数据手册只提供结温;好多解释里面提到的热阻也只是说结到壳,壳到散热器,散热器到环境)我总是和上面的对应不起来,那位大侠能画个图片解释一下..非常感谢!!!!!
Junction-Case Top - thermal resistance between the junction and the case top
Junction-Sides - thermal resistance between the junction and the sides of the case各位大侠,小弟还没有入门,请问上面上面三个解释分别对应那些参数;数据手册上面没有啊(通常情况下数据手册只提供结温;好多解释里面提到的热阻也只是说结到壳,壳到散热器,散热器到环境)我总是和上面的对应不起来,那位大侠能画个图片解释一下..非常感谢!!!!!
n**y1234_craC 
